Workplan
WP2 - Bonding
WP2 - Bonding

WP leader: Bernard Aspar (TRACIT)

Partners : IMEC, NCSR-D

 

Objectives:

Evaluation of different technologies to bond dies on a wafer
Development of a reliable process for die bonding onto structured wafers



Left: InP-die bonded on SOI-waveguide using BCB bonding (IMEC). Right: Metal patterns used for metalllic bonding (NCSR-Demokritos)


InP-dies bonded on Silicon CMOS wafer using molecular bonding (CEA)

Publications for Workpackage 2

journal publications

  • G. Roelkens, J. Van Campenhout, J. Brouckaert, D. Van Thourhout, R. Baets, P. Rojo Romeo, P. Regreny, A. Kazmierczak, C. Seassal, X. Letartre, G. Hollinger, J.M. Fedeli, L. Di Cioccio, C. Lagahe-Blanchard, 'A die-to-wafer bonding approach to photonic integration on a silicon platform (invited)', accepted for publication in Materials Today (accepted)
  • M. Kostrzewa, P. Regreny, M.P.Besland, J.L.Leclercq, G.Grenet, G.Hollinger, E.Jalaguier, P.Perreau, L. Di Cioccio, O.Marty, 'New InP/Si substrate for optoelectronics', Sensors & Actuators (published)
  • M. Kostrzewa, L. Di Cioccio, M. Zussy, J. C. Roussin, J. M. Fedeli, N. Kernevez, P. Regreny, Ch. Lagahe-Blanchard, B. Aspar , 'InP dies transferred onto silicon substrate for optical interconnects application ', Sensors & Actuators A 125 (2006) 411-414 (published)
  • G. Roelkens, D. Van Thourhout, R. Baets, 'Ultra-thin BenzoCycloButene (BCB) bonding of III-V dies onto an SOI substrate ', Electronics Letters, 41(9), p.561-562 (2005) (published)

conference publications

  • P. Robogiannakis, E. D. Kyriakis-Bitzaros, K. Minoglou, S. Katsafouros, A. Kostopoulos, G. Konstantinidis and G. Halkias, 'Heterogeneous integration technique of optoelectronic dies to CMOS circuits via metallic bonding ', ESTC 2006, 1st Electronics Systemintegration Technology Conference, Dresden, Germany, September 2006 (accepted)
  • L. Di Cioccio, B. Charlet, B. Biasse, et al., 'Direct Wafer and Die Bonding technologie applied to 3D integration on Silicon: Recent results at LETI', Device and packaging zorkshop, IMAPS, 20-23 March 2006 (accepted)
  • G. Roelkens, D. Van Thourhout, I. Christiaens, R. Baets, M. Smit, 'Ultra-thin BCB bonding for heterogeneous integration of III-V devices and SOI photonic components', ECIO conference Grenoble, May 2005 (published)
  • G. Roelkens, J. Brouckaert, I. Christiaens, D. Van Thourhout, R. Baets, 'Heterogeneous integration of III-V material and Silicon: fabrication and devices', IEEE/LEOS BENELUX Chapter - 2004 Annual Symposium, Belgium (published)
  • Fedeli J.M. Jeannot S.,Jousseaume V., Di Cioccio L., Kostrzewa M. Orobtchouk R., Maury P., Zussy M., 'Optical interconnect: a back end integration scheme for waveguides and optoelectronic InP components', Optics and Optoelectronics, SPIE, Warsaw, Aug 28-Sep 2, 2005 (published)
  • M. Kostrzewa, L. Di Cioccio, J. M. Fedeli, M. Zussy, P. Regreny, J. C. Roussin, N. Kernevez, 'Die-to-Wafer molecular bonding for optical interconnects and packaging', oral communication, EMPC 2005, June 12-15, Brugge, Belgium (published)
  • B.Aspar, C.Lagahe-Blanchard, H.Moriceau, 'Direct wafer bonding & thinning down : a generic technology to perform new structures', ECS conference 2005, Wafer bonding symposium, Québec, Spring 2005 (published)
  • Di Cioccio L, Biasse B, Kostrzewa M, Zussy M, Dechamp J, Charlet B, Vinet M, Fedeli JM, Poiroux T, Kernevez N, Regreny P, Lagahe-Blanchard C., Aspar B, 'Recent results on advanced molecular wafer bonding technology for 3D integration on Silicon', ECS Conference, Wafer Bonding Symposium, Quebec, Spring 2005 (published)
  • K. Minoglou, E.E. Kyriakis-Bitzaros, E. Grivas, S. Katsafouros, A. Kostopoulos, G. Konstadinidis, G. Halkias, 'Metallic Bonding of optoelectronic dies to silicon wafers ', Second conference on Microelectronics Microsystems and Nanotechnology, Athens, 14-17 Nov. 2004 (published)

other publications

  • K. Minoglou, '', 13th European Workshop on Heterostructure Technology, October 3-6, 2004, Heraklion, Crete, Greece (published)

Deliverables for Workpackage 2

#TitleLeadDateStatusDissAbstrFile

D21

Report on the different techniques evaluated to bond InP wafers onto silicon wafers

TRACIT

M8

completed

CO

abstract

-

D22

Report on bonding structured wafers

TRACIT

M12

completed

CO

abstract

-

D23

Die fabrication and preliminary bonding results

TRACIT

M18

completed

CO

abstract

-

D24

Report on the developed techniques for die to wafer bonding

TRACIT

M24

completed

CO

abstract

-



Last update:  22:48 17/01 2006